Diamond blades > New equipments > Saws & diamond cutting tools Tuck Point Blades - Wafer Segmented

  • DRY/WET Cutting – Premium Grade
  • Wafer blade design for lightning fast material removal.
  • Cleans, routs mortar and masonry materials.
  • 1/4 and 3/8 in wafer widths available.
  • Blade Diameters for Right Angle Grinders & Circular Saws.
  • Reference Series: WTK

Équipements PSA Discover our 2020 models now

Équipements PSA has a large inventory of new and used products for professionals in the greater Laurentian region. Contact us today to receive practical advice from our specialists.

200 +
Products in inventory
20,560 +
covered km2
8 +
Mobile units